Four-five semiconductor firms exploring India packaging plant: MoS IT

Stating that India’s future is bright in semiconductor ecosystem, Rajeev Chandrasekhar, Minister of State for Electronics and IT, on Saturday said the ministry will build a robust and a competitive presence in the global semiconductor ecosystem in the next ten years.
“We intend to build a robust, vibrant, and competitive presence in the global semiconductor ecosystem in the next ten years with the capital that Prime Minister Narendra Modi has given us. We certainly want to do what countries to the north of us took $200 billion in 30 years and could not succeed,” Chandrashekar said in SemiconIndia 2023 conference.
On Saturday, the central government announced that the Centre for Development of Advanced Computing (CDAC) had entered a collaboration with Arm, the world’s leading semiconductor IP company. As a part of this announcement, Arm, through its Flexible Access for Startups Program, will broaden its criteria to welcome more applicants.
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Other than this, two more startups, involved in semiconductor design, will participate in the SemiconIndia futureDESIGN DLI scheme. These two companies are Chennai-based Aheesa Digital Innovations Private Limited (Aheesa) focusing on telecom and cyber security domains, and Calligo Technologies, based in Bengaluru, serving global companies in artificial intelligence/machine learning segments.
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A Memorandum of Understanding (MoU) was also signed between the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc), Bengaluru, and Lam Research India. They aim to develop a specialised course for Indian universities, teaching semiconductor fabrication technology using Lam Research’s Semiverse Solutions virtual fabrication software, SEMulator3D.
They stated that the first stage is subjected to be completed by December 2023, and the second stage should be completed in June 2024.